Component
Chip packaging
Substrate, interconnect, and encapsulant around a silicon die.
Criticality
High
Unit cost
$1
Quality
70 / 100
US completeness
10.0
Made in US
40,000,000 units
Current demand
400,000,000 units
US exports
3,200,000 units
Opportunity score
87.0
Domestic vs international supply
Planned US investment, next 5 years
$2.2B
Expected extra output: 420,000,000 units per year
Product paths
- Ceiling fan map
- Clothes dryer map
- Clothes iron map
- Coffee maker map
- Commercial dryer map
- Commercial refrigerator map
- Commercial washer map
- Cooker hob map
- Copier map
- Desktop monitor map
- Dishwasher map
- E-bike map
- EV wall charger map
- Electric kettle map
- Elevator map
- Espresso machine map
- Forklift map
- Fridge map
- Gas furnace map
- Generator map
- Geyser map
- HVAC rooftop unit map
- Heat pump map
- Home battery map
- Ice machine map
- Industrial pump map
- Industrial sewing machine map
- Laptop map
- Lawn mower map
- Load center map
- Microwave map
- Oven map
- POS terminal map
- Passenger car map
- Room air conditioner map
- Serger map
- Sewing machine map
- Smartphone map
- Smoke alarm map
- Tablet map
- Television map
- Toaster map
- Vacuum cleaner map
- Washing machine map
- Wi-Fi router map
- Wireless earbuds map